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J T L Thong

Publications and source records attributed to J T L Thong.

2 recordsLinked to original sources

Electron-acoustic and surface electron beam induced voltage signal formation in scanning electron microscopy analysis of semiconducting samples.

The conditions for the detection of electron-acoustic (EA) and surface electron beam induced voltage (SEBIV) signals using a common sample mount and bottomside detection scheme are hereby discussed. It is shown that while the intrinsic properties of the sample under electron-beam irradiation would chiefly determine the presence of these contrast mechanisms, the manner in which the sample is mechanically and electrically configured in relation to the signal detection is crucial in determining the actual signal coupling mechanisms at work and hence the assumptions by which a robust and consistent interpretation of experimental results can be made. EA signals are detectable only if electrical coupling between the sample and the detector is defeated, a necessary pre-requisite as the signal magnitude of carrier-generated SEBIV coupling is 2-3 orders larger in most cases. With regards to SEBIV detection, bottomside SEBIV detection may be preferable to topside detection owing to minimization of topographic signal contribution, higher signal coupling efficiency and a less complex sample-detector mounting procedure.

Acoustics↗

Automatic integrated circuit die positioning in the scanning electron microscope.

In scanning electron microscope (SEM)-based integrated circuit (IC) failure analysis, there is often a need for manual location of a prespecified failure site in several ICs. Such a procedure is both tedious and time consuming. This paper presents a new vision-based die positioning system that can automatically locate a specified failure site without the need for a high-accuracy specimen stage. Depending on the appearance of the desired failure site, the system applies either image registration or feature tracking to locate the site. Experiments performed on a variety of IC samples show that the system is able to locate the failure site accurately, even in the presence of unfavorable conditions such as IC sample rotation and repetitive IC patterns.

Journal Article↗