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Biomedical subjects

L Boksman

Publications and source records attributed to L Boksman.

At least 19 recordsLinked to original sources

A 2-year clinical evaluation of two pit and fissure sealants placed with and without the use of a bonding agent.

The purpose of the study was to evaluate whether the clinical effectiveness of pit and fissure sealant was increased (as demonstrated by an increased retention rate) when a bonding agent was used prior to the placement of the sealant. Two pit and fissure sealants, Concise Light Cured White Sealant and Prisma Shield Light Cured Sealant, were placed in vivo with and without the use of the bonding agents, Scotchbond 2 and Prisma Universal Bond. After 2 years, 55% of the sample was available for recall. The retention rates for the sealants were 77% for Concise with Scotchbond 2, 84% for Concise with no bonding agent, 77% for Prisma Shield with Universal Bond, and 77% for Prisma Shield with no bonding agent. Results of this study indicated that the use of a bonding agent prior to the application of a pit and fissure sealant does not increase the retention rate.

Bisphenol A-Glycidyl Methacrylate↗

A visible light-cured posterior composite resin: results of a 3-year clinical evaluation.

Seventy-nine Class I and II light-cured composite resin restorations were evaluated for 3 years. Although the composite resin was not totally wear resistant, its overall clinical performance was acceptable, relative to most parameters of evaluation. The use of such a material in the posterior region may be justified in situations in which appearance is important, ideal circumstances predominate over conservative cavity design, and the patient understands the benefits and limitations of the procedure.

Bicuspid↗

The new generation amalgam alloys. Clinical considerations.

There is a good deal of current speculation that composite resin materials will shortly replace silver amalgam as routine posterior restoration systems. This article provides guidelines in the selection and clinical handling of the new generation high copper amalgam alloys.

Chemical Phenomena↗