Biomedical subjects

Sean Eichenlaub

Publications and source records attributed to Sean Eichenlaub.

3 recordsLinked to original sources

PubMed2006

A modeling approach to describe the adhesion of rough, asymmetric particles to surfaces.

A combined theoretical and experimental study of the adhesion of alumina particles and polystyrene latex spheres to silicon dioxide surfaces was performed. A boundary element technique was used to model electrostatic interactions between micron-scale particles and planar surfaces when the particles and surfaces were in contact. This method allows quantitative evaluation of the effects of particle geometry and surface roughness on the electrostatic interaction. The electrostatic interactions are combined with a previously developed model for van der Waals forces in particle adhesion. The combined model accounts for the effects of particle and substrate geometry, surface roughness and asperity deformation on the adhesion force. Predictions from the combined model are compared with experimental measurements made with an atomic force microscope. Measurements are made in aqueous solutions of varying ionic strength and solution pH. While van der Waals forces are generally dominant when particles are in contact with surfaces, results obtained here indicate that electrostatic interactions contribute to the overall adhesion force in certain cases. Specifically, alumina particles with complex geometries were found to adhere to surfaces due to both electrostatic and van der Waals interactions, while polystyrene latex spheres were not affected by electrostatic forces when in contact with various surfaces.

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PubMed2004

Roughness models for particle adhesion.

The effects of different surface roughness models on a previously developed van der Waals adhesion model were examined. The van der Waals adhesion model represented surface roughness with a distribution of hemispherical asperities. It was found that the constraints used to define the asperity distribution on the surface, which were determined from AFM scans, varied with scan size and thus were not constant for all surfaces examined. The greatest variation in these parameters occurred with materials that had large asperities or with materials where a large fraction of the surface was covered by asperities. These rough surfaces were modeled with fractals and also with a fast Fourier transform algorithm. When the model surfaces generated using the Fourier transforms are used in the adhesion model, the model accurately predicts the experimentally observed adhesion forces measured with the AFM.

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PubMed2002

Hamaker constants in integrated circuit metalization.

A new method for determining Hamaker constants was examined for materials of interest in integrated circuit manufacture. An ultra-high vacuum atomic force microscope and an atomic force microscope operated in a nitrogen environment were used to measure the interaction forces between metals, dielectrics, and barriers used during the metalization portion of integrated circuit manufacturing. The materials studied included copper, silver, titanium nitride, silicon dioxide, poly(tetrafluoroethylene), and parylene-N. Spheres coated with a material of interest were mounted on AFM cantilevers and brought into contact with substrates of interest. The interaction force was measured as the cantilever approached the substrate but before the two surfaces came into contact, and also when the particle was pulled out of contact with the substrate. The Hamaker constant calculation from the contact measurement is based on an adhesion model that quantifies the contribution of geometrical, morphological and mechanical properties of materials to the measured adhesion force. Hamaker constants determined with this new approach were compared with values found by using the Derjaguin approximation for a sphere to describe the interaction force as the cantilever approaches the surface. Both approaches produced similar values for most of the systems studied, with variations of less than 10%.

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