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Yongsok Seo

Publications and source records attributed to Yongsok Seo.

4 recordsLinked to original sources

In situ compatibilizer-reinforced interface between a flexible polymer (a functionalized polypropylene) and a rodlike polymer (a thermotropic liquid crystalline polymer).

We present an investigation of the interfacial reinforcement between a flexible folded-chain polymer (functionalized polypropylene-maleic anhydride-grafted polypropylene, MAPP) and a rodlike polymer (a themotropic liquid crystalline polymer, TCLP - poly(ester amide)). Fracture toughness was measured using an asymmetric double-cantilever beam test (ADCB). High fracture toughness at the bonding temperature of 200 degrees C indicates that a chemical reaction has occurred at the interface to provide a strong interaction between MAPP and TLCP. Despite the higher modulus of TLCP, the fracture was propagated in the TLCP phase because of inherent TLCP domain structure. An analysis on the locus of failure revealed that at constant bonding temperature the fracture toughness between MAPP and TLCP was influenced not only by the bonding temperature but also by the bonding time. The fracture toughness increased with the bonding temperature until 200 degrees C was reached and then decreased at higher bonding temperature. The fracture toughness increased with annealing time until it reached a plateau value. We ascribe the dependence of the fracture toughness on the bonding time to the progressive occurrence of two different failure mechanisms, adhesive failure and cohesive failure. The adhesive strength increased with bonding temperature whereas the cohesive strength decreased because of weaker adhesion between TLCP crystalline domains. The dependence of fracture toughness on bonding time was explained in terms of the TLCP crystalline domain structure.

Journal Article↗

Nonwetting process for achieving surface functionalization of chemically stable poly(tetrafluoroethylene).

Using a low-energy Ar+ ion-beam with and without a reactive gas, chemically stable poly(tetrafluoroethylene) (PTFE) films were modified to have special surface features. The adhesion strength between the PTFE and the copper was significantly improved because of both changes in the surface topography and chemical interactions due to PTFE functionalization (oxidation and amination). The surface modification altered the failure mode from adhesive failure for the unmodified PTFE/Cu interface to cohesive failure for the surface-modified PTFE/Cu layer interface.

Journal Article↗

Polyetheretherketone (PEEK) surface functionalization by low-energy ion-beam irradiation under a reactive O2 environment and its effect on the PEEK/copper adhesives.

A low-energy Ar+ ion beam was used to modify the surface of a polyetheretherketone (PEEK) film. The modification reaction proceeded with or without oxygen gas injected during the irradiation. The surface functional groups of the modified PEEK were confirmed with X-ray photoelectron spectroscopy as increasing various oxygen-containing functional groups. The concentration of the functional groups varied rapidly with the irradiation time, reached a maximum value, and then slowly decreased. The surface morphology of PEEK was substantially changed by ion-beam irradiation. Surface smoothening occurred so that the surface roughness reached almost constant value after some irradiation time. The incorporation of functional groups on the PEEK surface and the surface topology change had opposite effects on the adhesion strength between PEEK and copper. Dominance of the former was evident because the lap-shear strength initially increased with the irradiation. The special surface features significantly enhanced the adhesion strength between the evaporated copper layer and the modified PEEK surface. However, the decrease in the surface roughness with a long time irradiation implies a decrease in adhesion strength due to a smaller contact area, and the shear strength due to topology change also slowly decreased after a long time irradiation.

Adhesives↗