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Zhenan Bao

Publications and source records attributed to Zhenan Bao.

4 recordsLinked to original sources

Organic light-emitting diodes formed by soft contact lamination.

Although tremendous progress has been made in organic light-emitting diodes (OLEDs), with few exceptions they are fabricated in the standard way by sequentially depositing active layers and electrodes onto a substrate. Here we describe a different approach for building OLEDs, which is based on physical lamination of thin metal electrodes supported by an elastomeric layer against an electroluminescent organic. This method relies only on van der Waals interactions to establish spatially homogeneous, intimate contacts between the electrodes and the organic. We find that devices fabricated in this manner have better performance than those constructed with standard processing techniques. The lamination approach avoids forms of disruption that can be introduced at the electrode/organic interface by metal evaporation and has a reduced sensitivity to pinhole or partial pinhole defects. In addition, because this form of "soft" contact lamination is intrinsically compatible with the techniques of soft lithography, it is easy to build patterned OLEDs with feature sizes into the nanometer regime. This method provides a new route to OLEDs for applications ranging from high performance displays to storage and lithography systems that rely on subwavelength light sources.

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Retraction.

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Soft, conformable electrical contacts for organic semiconductors: high-resolution plastic circuits by lamination.

Soft, conformable electrical contacts provide efficient, noninvasive probes for the transport properties of chemically and mechanically fragile, ultrathin organic semiconducting films. When combined with high-resolution printing and lamination techniques, these soft contacts also form the basis of a powerful technique for fabricating flexible plastic circuits. In this approach, a thin elastomeric film on a plastic substrate supports the electrodes and interconnections; laminating this substrate against another plastic substrate that supports the gate, dielectric and semiconductor levels establishes effective electrical contacts and completes the circuits. In addition to eliminating many of the problems associated with traditional layer-by-layer fabrication strategies, this lamination scheme possesses other attractive features: the transistors and circuit elements are naturally and efficiently encapsulated, and the active organic semiconductor layer is placed near the neutral mechanical plane. We demonstrate the features of soft, laminated contacts by fabricating large arrays of high-performance thin film transistors on plastic substrates by using a wide variety of organic semiconductors.

Journal Article↗