TY  - RPRT
TI  - Copper/solder intermetallic growth studies.
AU  - K W Kirchner
AU  - G K Lucey
AU  - J Geis
PY  - 1993
DO  - 10.1002/jemt.1070250522
UR  - https://pubmed.ncbi.nlm.nih.gov/8400445/
ID  - 8400445
ER  -