TY  - RPRT
TI  - Bond strength with APF applied after acid etching.
AU  - C L Meng
AU  - C H Li
AU  - W N Wang
PY  - 1998
DO  - 10.1016/s0889-5406(98)70170-2
UR  - https://pubmed.ncbi.nlm.nih.gov/9810046/
ID  - 9810046
ER  -