TY  - RPRT
TI  - Copper electrodeposits in paper support.
AU  - DB Hibbert
AU  - JR Melrose
PY  - 1988
DO  - 10.1103/physreva.38.1036
UR  - https://pubmed.ncbi.nlm.nih.gov/9900467/
ID  - 9900467
ER  -